Organizing Committee Member

Ephraim Suhir

Ephraim Suhir

Professor


Portland State University


USA


Biography

Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, Technical University, Vienna, Austria, and James Cook University, Queensland, Australia. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA, is a Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 450+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including the 1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Reed Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline (Structural Analysis of Electronic Systems). Ephraim is the third Russian American, after S. Timoshenko and I. Sikorsky, who received this prestigious award. His most recent awards are the 2019 IEEE Electronic Packaging Society (EPS) Field award for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems and the 2019 Int. Microelectronic Packaging Society (IMAPS) Lifetime Achievement Award for making an exceptional, visible, and sustained impact on the microelectronics packaging industry and technology.

Research Area

Materials Science and Engineering, Photonics, Fiber Optics, Mechanics of Optical Fibers, Polymeric Materials in Electronics and Photonics